Contract Electronic Manufacturing

• From complex fully automated production to conventional assembly, rework facilities and cable assembly.
• Surface Mount - Fully automated high speed assembly line based around the MyData range of machines.
• Through Hole Assembly - Semi-automated conventional assembly using light guided assembly stations. Dual wave solder technology utilised to give consistent reliable solder joints.
• Rework - Facilities available for rework of all component types including BGA, QFP, CSP, SOIC and all conventional component types.

Contact LPA Excil Electronics

Access List of downloadable brochures.